GSSG Stackup Deep Dive: Routing, Impedance, and HDI

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Altium Develop unites your stackup, routing, and manufacturing workflows in one cloud platform so your signal integrity decisions reach the fabricator without friction: https://www.altium.com/develop?utm_source=youtube&utm_medium=video&utm_campaign=pcb-routing&utm_content=gssg-stackup-design-internal-signal-routing-impedance-control

A ground-signal-signal-ground (GSSG) stackup flips the traditional four-layer architecture inside out, placing ground planes on the outer layers and routing your signals on the two internal layers. In this Altium Academy deep dive, host Zach Peterson walks through a real one-minute design review submission to show how to set up a GSSG stackup correctly in the Layer Stack Manager — from copper weights and dielectric thickness to defining signal layers, calculating controlled impedance, and choosing the right reference planes for 50-ohm traces.

You'll also learn the routing techniques that keep these boards manufacturable and electrically clean: adding a little routing on the outer ground layers without breaking the reference, using coplanar impedance profiles with ground pour on internal layers, stitching ground across plane splits, and applying orthogonal routing to minimize broadside coupling and crosstalk. The video closes with more exotic builds — blind vias, buried vias, and HDI microvia structures — so you can adapt a GSSG arrangement to four-layer or six-layer designs alike.

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Схемы по заработку в интернете
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